A review of development of FPC

Flexible printed circuits (FPC) is a circuit wiring flexible material.  The advantage of flexible printed circuits(FPC) are thin, lightweight, and excellent heat resistance and durability.  These contributed to make devices more compact, lighter and thinner.  This review will provide a basic assessment of flexible printed circuits (FPC).

Single-sided flexible circuits (FPC)

Single-sided flexible circuits (FPC) consist of a single conductor layer on a flexible film with access to circuit-termination features accessible from one side only.  Single-sided flexible circuits (FPC) are manufactured with or without coverlays and protective coatings and highly cost effective.

Double-sided flexible circuits (FPC)

Double-sided flexible circuits (FPC) is constructed by variou means such as separate conductors on both sides of the base film and printed conductors by printed insulating coverlays.  The most popular flexible-circuit through-board interconnectivity technique is the plated through hole (PTH).

Multilayer flexible circuits (FPC)

Multilayer flexible circuits (FPC) are conplex to construct and have high costs, and consist of bonded conductive layers that are interconnected by means of plated through-holes.  A maxium of 25 layers means that over multiple layers laminate stress  can cause through-hole interconnects to barrel and stretch, restricting their reliability.
Rigid-flex circuits are hybrid constructions consisting of rigid and flexible substrates laminated together.  Like double-sided and multilayer circuits they make use of PTH interconnects where required.

Manufacturing process for double-sided FPC

The following feature of manufacturing process for double-sided FPC shows a typical manufacturing flow chart for double-sided FPC.  After (1) basematerial cutting, (2) NC drilling, and (3) PTH, the process is fundamentally the same as with single-sided FPC.  Circuit formation, insulation treatment, plating and other surface treatment steps are called the front-end process or upper process, and manufacturing is implemented in the form of rolls or fixed-sized sheets (worksheets).

Circuit formation is conducted using a photosensitive resin (etching resist) called "dry film" (DF) in a process of exposure, developing and etching.  Insulation treatment is conducted by heat lamination with thermosetting adhesive on PI film where holes have been selectively opened as coverlay openings with a die or other device.

The photosensitive covercoat is formed through a process of exposure and developing that is the same as for circuit formation, followed by heat treatment and UV exposure.  Nickel/gold, solder, or other material plating is applied to the exposed copper depending on the electroplating or electroless plating method.  Anti-oxidation treatment is sometimes used instead of plating.

In the front-end process or lower process, worksheets are divded into sizes the are easy to treat.
Usually, after the application of stiffener and double-sided tape, the product form is finished by punching using a die.  When the stiffener requires heat-resistance, heat lamination is done with a thermosetting type adhesive.

When heat-resistance is unnecessary, attachment is done with double-sided tape.  Inspection is usually conducted on every piece and includes electrical inspection to detect if circuits are open or have shorts and visualinspection to check other things.

Recently, it has become common to do every step up to parts mounting, so more sophisticated inspection techniques are required.

Manufacturing process for double-sided FPC
Manufacturing process for double-sided FPC
【版主廣告區】
  • 柔性印刷電路板用11TON打拔機(附雙搭載回轉機構)
  • 柔性印刷電路板用11TON沖床(附雙搭載回轉機構)
  • 柔性印刷電路板用11TON雙搭載打拔機
  • 柔性印刷電路板用15TON打拔機 
  • 柔性印刷電路板用16TON打拔機
  • 柔性印刷電路板用16TON打拔機(雙搭載/單供料)
  • 柔性印刷電路板用16TON雙搭載打拔機-單供料平台
  • 柔性印刷電路板用170 TON快壓機
  • 柔性印刷電路板用17TON伺服打拔機(雙搭載)
  • 柔性印刷電路板用20TON打拔機
  • 柔性印刷電路板用46TON真空壓著機
  • 柔性印刷電路板用520型單張假接著機(不含架台)
  • 柔性印刷電路板用620型假接著機(連續、單張共用,附段差部)
  • 柔性印刷電路板用620型假接著機(連續單張共用,附段差部)(加裝貼膠帶平台)
  • 柔性印刷電路板用620型連續假接着機 
  • 柔性印刷電路板用80TON快壓機
  • 柔性印刷電路板用80ton壓著機(附sensor及光罩)
  • 柔性印刷電路板用BLOCK假接著機
  • 柔性印刷電路板用Cover layer裁斷機
  • 柔性印刷電路板用CPF分離連續沖製機
  • 柔性印刷電路板用ESI UV Laser用捲出捲取裝置(500mm)
  • 柔性印刷電路板用IR雙列卷出卷取機
  • 柔性印刷電路板用LPF 連續沖孔機
  • 柔性印刷電路板用LPF沖孔機-450L油壓系統25TON模式
  • 柔性印刷電路板用LPF連續沖孔機(450-DPF式樣)
  • 柔性印刷電路板用MASK貼合機+單列收料機
  • 柔性印刷電路板用RNC-8卷出卷取拉料機
  • 柔性印刷電路板用RTR 100TON-TPX雙面壓著機
  • 柔性印刷電路板用RTR乾膜壓合機
  • 柔性印刷電路板用RTR電漿處理装置
  • 柔性印刷電路板用RTR複卷機
  • 柔性印刷電路板用RTR覆蓋膜壓合機(500W)
  • 柔性印刷電路板用RTR雙面100TON
  • 柔性印刷電路板用RTR雙面板假接機
  • 柔性印刷電路板用RTR雙面乾膜壓合機(250mm寬)
  • 柔性印刷電路板用RTR雙面乾膜壓合機(含濕膜)
  • 柔性印刷電路板用RTR雙面假接著機(500mm)
  • 柔性印刷電路板用RTS裁切機(搭載伺服機構式樣)
  • 柔性印刷電路板用SR裁斷機
  • 柔性印刷電路板用STR雙面乾膜壓合機(420mm)
  • 柔性印刷電路板用STR雙面乾膜壓合機(450mm)
  • 柔性印刷電路板用STR雙面乾膜壓合機(650mm)
  • 柔性印刷電路板用STR雙面乾膜壓合機(含搭載清潔裝置)
  • 柔性印刷電路板用Unloader 湯洗乾燥收料機
  • 柔性印刷電路板用大版面真空壓著機
  • 柔性印刷電路板用大版面假接著機
  • 柔性印刷電路板用手動貼膠帶機
  • 柔性印刷電路板用半自動貼膠帶機
  • 柔性印刷電路板用印刷後收料機(無桿缸-無隔紙)
  • 柔性印刷電路板用印刷機卷出卷取機
  • 柔性印刷電路板用自動SR壓著機    
  • 柔性印刷電路板用自動前導板貼合機 
  • 柔性印刷電路板用自動單面連續曝光機
  • 柔性印刷電路板用自動貼膠帶機
  • 柔性印刷電路板用卷出卷取機
  • 柔性印刷電路板用油墨收料機新製-伺服驅動
  • 柔性印刷電路板用單列橫向搭載機
  • 柔性印刷電路板用單張假接著機(520型)
  • 柔性印刷電路板用單張假接著機-雙撕離裝置
  • 柔性印刷電路板用黑孔線自動收放板機(含清潔機構)
  • 柔性印刷電路板用滾筒攪拌機
  • 柔性印刷電路板用撕背膠機
  • 柔性印刷電路板用壓膜前處理線自動收放板機
  • 柔性印刷電路板用雙列伺服驅動收料機(附隔紙放置)
  • 柔性印刷電路板用雙面乾膜壓合機
 

Copyright © 2013-2014 Jeffの網記本 | Powered by Blogger